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0.80MM PITCH, 100Ω BOARD-TO-BOARD SOLUTION
Amphenol high speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals.
Broad range of stacking heights and pin counts are offered to provide maximum design flexibility.
Amphenol 0.80mm pitch connector design is suitable for high performance applications.
Amphenol ICC, a leader in flex circuit connectors offers the most innovative and complete range of products in the industry. Amphenol ICC offers products in LIF (low insertion force) and ZIF (zero insertion force), top and bottom contact options, vertical and right angle orientations, surface mount and through hole terminations in contact spacing options all the way down to 0.2mm with finer pitch products on the way.
Additional features, such as optional cable locks and additional mounting devices, insure that Amphenol ICC has a solution for almost any application, no matter how demanding.
As your connection to innovation, Amphenol ICC continues to bring you unique solutions that not only give you the footprint you need but help to maximize the quality level of your application. Many of our flex circuit connectors offer ZIF with prehold, which applies a small retention force on the cable to hold it in place until the actuator is locked. Amphenol ICC introduced the first flex connector with a back side flip actuatorthat allows the user to insert the flex cable and lock the actuator with one hand. Amphenol ICC improved that feature on many products by modifying the connector housing to provide visual confirmation that the flex cable is mated properly. Amphenol ICC was also the company that first brought you the option of an FFC/FPC connector under 1mm in height. These features combine to insure your application has the highest quality possible when it leaves your site. Utilizing 1.00mm contact spacing has become an economical way to circuit connectors in the industry to terminate displays as well as make difficult board to board connections.
Amphenol ICC's new 1.2mm pitch wire to board connectors are low profile (mated height of 2.50mm) and compact with pin count availability for 3, 4 and 6 pin counts. The plug and receptacle uses a frictional mating method to provide the retaining function to enable up to 20 mating cycles.
The low profile and compact design of the connector gives its advantage in applications where space is tight and the enclosed receptacle profile make sure that the side entry matings are easy in tight spaces. The additional polarized key slots prevent any misalignment issues between the plug and receptacle.
Amphenol ICC's 1.25mm pitch wire-to-board connector series is designed for a wide variety of applications in Industrial, Automotive and Consumer markets.
The range consists of terminals, crimp housings and PCB headers in straight and right angle, surface mount and through mount configurations. It is a single row design, available with from 2 to 15 circuits. A crimping application tool is also available for wire harness assembly.
Unlike many other products for the same applications, Amphenol ICC's 1.25mm Wire-To-Board range conforms to the EU Industry Safety Standard, PCB header material meets halogen free requirements and the products can be operated in the temperature range from -40°C to +105°C.
The 29-position, SAS receptacle and plug connectors enable the implementation of the high-speed, Serial Attached SCSI (SAS) hard disk drive (HDD) interface that is replacing the SCSI drive connection in enterprise storage applications in servers and storage systems. This range conforms to SFF8482, SFF8680 and is capable of meeting up to 12Gb/s.
The SAS connector system is designed to support hot plugging and blind mating of HDDs. Staggered contact lengths provide sequential mating of contacts to enable hot plugging. Molded guide posts provide angled lead-in to compensate for connector misalignment, allowing the device plug and the receptacle to self-align during the mating process. Most connectors also feature stamped retention clips that provide additional mechanical strength for robust PCB attachment.
Amphenol ICC also offers wide-base housing options on vertical backplane receptacles for even more stability.
The high-speed, serial interface is designed to support differential signaling, initially at speeds of 3Gb/s and evolving to 12Gb/s. A SAS receptacle accepts either SAS or SATA (Serial ATA) drives, giving the system manufacturer the option to plug either drive to a backplane. Because both technologies have similiar electrical interfaces, users have the choice of deploying cost-effective SATA drives for bulk storage or higher-performance SAS drives for mission-critical applications.
Amphenol ICC offers a wide range of SAS plug and receptacle connectors for enterprise applications. Vertical and right angle connector configurations provide options for use in servers, server or storage blades, storage backplanes, HDD carriers and HDDs.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
The connector utilizes Amphenol ICC technology for a shieldless design with no metallic plates and closely coupled differential pair design to yield low loss and low crosstalk.
AirMax VS2® connectors are mating-compatible to both AirMax VS® and AirMax VSe® connectors and require no changes to connector PCB footprints. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new and upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards, or blades that are already in the field as well as new or future higher-speed module cards.
Right angle and vertical receptacles and headers support backplane, midplane and coplanar applications.
Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.
The connectors combine Amphenol ICC technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.
Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications.
The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.
The AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by Amphenol ICC, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications.
The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS® connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.
This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost.
Further enhancements of the AirMax® product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs.
Amphe-309 series includes plugs, connectors, receptacles, inlet, and mechanical interlocks, all of which comply with the requirements of IEC 603 09-1 & 2, EN 60 309-1 & 2, BS 4343-2 1992, and UL 1682 & 1686.
The Amphe-309 consists of both IP44 (Splashproof) and IP67 (Watertight) devices for 16A, 20A, 30A,32A, 60A, 63A, 100A and 125 A.The series range covers all clock positions in use from low profile, watertight, and Heavy Duty solutions.
Approved and certified by CE, UL, CSA and CCC, Amphe-309 covers commercial and industrial applications for international markets, as well as, the North American market.
Features & Benefits
· Plug, receptacle, connector, inlet and mechanical interlock
· 16A to 125A, up to 690V or 500V DC
· Low voltage <50V available
· ATEX/IECEx version available
· Custom Amphe-309 cable assemblies
· IP 44
· IP 67
· UL, CAS, CE certified
BarGuide® connectors provides a high current power interconnection with quick connect/disconnect function for space constrained board-to-board, board-to-busbar, and busbar-to-busbar power distribution applications.
Large surface contact area ensures small voltage loss, minimum heat generation and low insertion/ extraction forces
Current carrying capacity from 65Amps to 140Amps
Press-fit tails for mounting on both circuit boards and busbars
Vertical design for parallel/mezzanine applications
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance connectors.
Up to 170A at 30°C temperature rise in still air
10 independent points of contact for low resistance and high reliability
Optional grounding shield on the board connector
Stainless steel helper spring ensures proper mating force and contact resistance
AGT® plated contacts deliver lower resistance without the high cost of gold
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance.
FLEXIBLE SOLUTION FOR HIGH SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ series meets the new 25Gb/s performance requirement.
BOARD-TO-BOARD SOLUTION FOR HIGH SPEED AND HIGH DENSITY APPLICATIONS
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is fully compatible with the existing BergStak® 0.80mm product recommended by the Open Compute Project (OCP).
Backward mateable and footprint compatible with existing BergStak® 0.80mm
Available in 80 and 120 positions. Other position
Available in 5, 8, 12 and 16mm stack heights
The BergStak® product range is expanded to include 0.5mm mezzanine connectors.
Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is also offered in 10 to 60 positions in 10 position increments.
Designed with scoop-proof housing, the terminals are protected from damage when parts are mated.
BergStak® 0.5mm mezzanine connector comes with two options: Metal hold-down option ensures higher retention force; Locating pegs option eases manual assembly. Both options can be configured within a single connector.
BergStak® 0.5mm mezzanine connector is a comprehensive and versatile solution. The 0.5mm double row contact pitch feature saves space on PCB and is highly suitable for high density applications in consumer and industrial markets.
FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol ICC's BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5mm to 20mm stack heights in 1mm increments
BergStik® 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact.
This product range is extended with BergStik® 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles.
BergStik® product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.
HIGH PERFORMANCE I/O FOR PoE & INDUSTRIAL
Boltrack™ connector is a robust and reliable interconnect solution. It features high power and signal performance, small form factor, field termination, EMI shielding, lightning protection and resistivity to over voltages. Boltrack™ connector comes in 4 pair right angle board and plug mating combination.
In an era of hyper connectivity, Internet of Things (IoT) calls for more Power over Ethernet (PoE) enabled devices on the network. Besides this, PoE market continues to expand as increased power levels support broader range of powered devices. There is a growing demand for higher power delivery of 100 Watts plus over the four pair ecosystem. At the same time, prolific data growth demands connectors with good signal integrity performance. Boltrack™ connector enables best in class power and signal performance.
The Clincher™ 2.54mm pitch connector family includes single-row pin and receptacle connectors designed for termination to flat flexible circuitry. Amphenol ICC's proven Clincher design has become the standard by which other products are judged. The addition of keying and active latching options to the receptacle offering make Clincher products the smart choice for even more applications. All receptacle connectors use the same customer-preferred and patented Clincher contact and are ideal for applications where shock or vibration are concerns.
Compression connector is a single piece connector used together with flexible circuit or PCB
HYBRID CONNECTOR FOR VERSATILE BOARD-TO-BOARD (BTB) APPLICATIONS
Cool Edge Hybrid Power and Signal connectors bring high speed and high power into a one-piece card-edge package. These versatile solutions address multiple standards like PCIe, SAS/SATA, networking and offer multiple BTB configurations such as mezzanine, coplanar and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable.
HIGH SPEED SPACE-SAVING CONNECTOR FOR BOARD-TO-BOARD (BTB) APPLICATIONS
Cool Edge Signal connectors bring high speed PCIe support into a one-piece card edge package with 16Gb/s Gen4 and 32Gb/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher density applications. Housing design is kept simple with an overall reduced footprint, providing additional benefits over Standard PCIe solutions.
HYBRID CONNECTOR FOR COPLANAR BOARD-TO-BOARD APPLICATIONS
Cool Stack Hybrid Power and Signal connectors bring high speed and high power into a one-piece solution while addressing multiple networking standards like PCIe, and SAS/SATA.
The standard and high density D-Subminiature connectors are available in five shell sizes offering a wide choice of contact positions: 9, 15, 25, 37, and 50 in standard density and 15, 26, 44, 62, 78, and 104 positions in high density. We offer filtered, sealed and compliant tail designs as well as custom crimp type or other terminations
Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical. Since many years Amphenol ICC has been offering a wide range of D-Subminiature connectors to meet various design requirements including those in harsh environment.
These high performance connectors are designed for severe environment applications in the field of Telecommunications - data transmission, private automatic branch switching... Connectors for Aerospace, military (125°C) class and for particularly severe applications, especially high temperature (+155°C) class available. It features machined contacts and is available with solder bucket, straight spills, angled spills and wire wrap terminations.
The new High Density D-Subminiature range is part of Amphenol ICC's I/O-Connections portfolio which provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. Amphenol ICC's I/O connector solutions complete your board and system designs by providing high-density and high-speed interfaces to enable interconnect technologies for networking, storage and memory and complementary products for power distribution. Our range of standardized I/O solutions enables full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI. Amphenol ICC also has the capability to provide customized I/O solutions optimized to address application specific requirements.
Through Amphenol ICC's high-speed, power, assembly and mechanical packaging expertise, you gain the advantage of getting your signals out of the box at optimal cost and performance. Amphenol ICC's I/O connectors - coupled with Amphenol ICC's extensive range of backplane and board-to-board connectors and cable assembly products-enable complete link solutions for your equipment designs.
Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These D-Subminiature connectors are one of the most popular Input - Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. Since many years Amphenol ICC offers a wide range of D-Subminiature connectors to meet all design requirements, and to address increasing needs for high density packaging, Amphenol ICC developed the D-Subminiature High Density Range.
Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Military, Instrumentation and Medical. Since many years Amphenol ICC has been offering a wide range of D-Subminiature connectors to meet various design requirements including those in harsh environment.
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol ICC offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature connectors available in solder bucket, straight and angled version. They come with a large number of mounting options.
Memory module sockets from Amphenol ICC are designed to accept most industry standard memory types (DDR, DDR2, DDR3) and formfactors such as DIMM, 50-DIMM or VLP DIMM. The sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs and embedded applications in communications and industrial equipment.
DDR3 memory sockets accept 240-position DDR3 memory modules as per JEDEC M0-269. Low contact resistance versions support the use of RDIMM (registered DIMM) which is becoming more and more popular in use because it helps further reducing power consumption in data communication systems such as servers.
DDR3 memory sockets from Amphenol ICC are available in various form factors including VLP (very low profile) providing an overall connector height of less than 20.8mm and comply to JEDEC 80-007 specifications.
Vertical DDR4 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.
The low-resistance contacts also support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in datacenter hardware such as servers, storage and networking equipment. The low 2.4mm module seating plane and slim ejector designs reduce the overall profile of the connector and installed module to help optimize airflow.
Surface-mount (SMT), plated-through-hole (PTH) solder, and press-fit (PF) connector termination options are offered.
HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260position SO-DIMM connectors are available in 4, 5.2, 8, 9.2mm height, in standard or reverse options.